ECX-4000
製品特長
PRODUCT FEATURE
・24コアのインテル® Core™ Ultra 200Sシリーズプロセッサー＋Intel® W880 PCH採用 (Arrow Lake)
・最大36 TOPSのIntel® NPUおよびXe-LPGベースのGPU内蔵
・2枚DDR5 6400MHz、最大96GBまで拡張可能、ECCオプション対応
・2基10G SFP+、8基2.5GigE LAN（うち4基PoE+対応）、1基GigE LAN装備
・6基USB 3.2 Gen 2、絶縁型DIO ×16、4基COMポート
・2基M.2 Key B、1基Key Eサポート、オプションでSUMIT A・B対応
・9V～50VDC冗長電源入力、ソフトウェアイグニッション対応
・Intel® vPro、Time-Sensitive Networking（TSN）、TCCとTPM 2.0規格サポート
オプションによるOpenVINO™ Toolkit x VHub AIでワンストップAIoTソリューション提案
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New Gen AI PC Platform
・The latest Intel Core Ultra 200S series processor running with Intel W880 Chipset (Arrow Lake-S), featuring up to 24-core with new P-core and E-core architecture, delivering outstanding power productivity and optimized AI workload by Intel® Thread Director for optimal performance, efficiency and security, max 65W CPU supported.
・Advanced Intel Core Ultra CPU + Integrated NPU + Xᵉ LPG Graphics Architecture enables a Fast Response, Low Power, and High Throughput AI Acceleration possible, delivering up to 36 TOPS.
・2 DDR5 6400MHz CSODIMM, up to 96GB ECC/non-ECC Memory.
・High-speed data transfer : PCIe 5.0 (32GT/s), USB 3.2 Gen 2 (10G), 10G SFP+ (10G), SATA III (6G), 2.5GigE (2,5G), GigE LAN (1G). 
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Leading Integration
Versatile Ethernet Offerings : 10G SFP+, 2.5GigE PoE+, 2.5GigE LAN, GigE LAN
・Max 9 LAN : 4 IEEE 802.3at 2.5G PoE+ (25.5W/48V), 4 2.5GigE LAN, 1 GigE LAN with iAMT.
・6 10G USB 3.2 Gen 2, 4 COM RS-232/422/485, 16 Isolated DIO.
・Expansion : M.2 Key B, M.2 Key E, optional SUMIT A, B
・Storage : Dual external 2.5" SSD trays, optional supports 2 front-access M.2 SSD trays
・Wireless Connections : 5G/WiFi 7/BT/4G/LTE/GPRS/UMTS
・Multiple displays : Dual DisplayPort (8K), DVI-I (Full HD) and HDMI 2.0 (4K)
・Optional supports Intel OpenVINO toolkit for AI applications.
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Rugged Reliability
・Fanless -40°C to 75°C operation.
・ECC Memory supported.
・Always-on wireless communication supports seamless 5G/WiFi 7/BT/4G/LTE/GPRS/UMTS data delivery.
・Optional SUMIT A and SUMIT B support versatile expansion functions.
・DC 9V to 50V wide range power input.
I・gnition Power Control for in-vehicle operation.
・EN50155 & EN50121-3-2.
・Anti-shock, Anti-vibration. 
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Optimized Manageability
・Redundant Power : DC 9V to 50V Power Input.
・User-friendly chassis design supports easier system maintenance.
・Considerate Toolless Design : SIM Card Socket Cover, Antenna Cover.
・Front-access & lockable SSD trays, RAID 0, 1 data protection.
・Software Ignition Power Control, Remote Power Switch.
・Real-time capable with Intel Time Coordinated Computing (Intel TCC) and support for Time-Sensitive Networking (TSN).
・Smart Managment features : Intel vPro, TSN, TCC, TPM 2.0, PXE, Wake on LAN, Watchdog Timer.
製品仕様
Product Specifications
| システム | |
| プロセッサ | Intel® Core™ Ultra 200S Series processors, 65W/35W, max 24-core (Arrow Lake-S) |
| チップセット | Intel® W880 Chipset |
| バイオス | AMI |
| SIO | IT8786E |
| メモリ | 2 DDR5 6400MHz CSODIMM, up to 96GB (ECC/Non-ECC) |
| OS | Windows 11, Windows 10, Linux |
| AI専用プロセッサ | |
| NPU | Intel® AI Boost dedicated Low Power AI Engine |
| GPU | Intel® Xᵉ LPG Graphics architecture, up to 4 Xᵉ Graphics Engines |
| Display |
– 2 DisplayPort : Up to 7680 x 4320 @60Hz
– 1 HDMI 2.0 : Up to 3840 x 2160 @60Hz
– 1 DVI-I : Up to 1920 x 1080 @60Hz
|
| I/Oインターフェイス | |
| シリアルポート | 4 COM RS-232/422/485 |
| USBポート | 6 USB 3.2 Gen 2 |
| Isolated DIO | 16 Isolated DIO : 8 DI, 8 DO (Optional) |
| LEDランプ | Power, HDD, PoE, Wireless |
| SIMカード | 2 External SIM Card Sockets |
| 拡張スロット | |
| M.2 |
– 2 M.2 Key B Socket (3042/3052/2280, PCIe x2/USB 3, default/SATA)
– 1 M.2 Key E Socket (2230, PCIe x2/USB2)
|
| SUMIT | 2 SUMIT Slot (Optional) |
| ストレージ | |
| SATA |
2 SATA III (6Gbps) support software RAID 0, 1
(Storage devices please refer to Order Information)
|
| M.2 |
– 1 M.2 Key M Socket (2280, PCIe x4)
– 2 Front-access M.2 Socket (2280, PCIe x4, Optional)
|
| オーディオ | |
| コーデック | Realtek® ALC888S-VD, 7.1 Channel HD Audio |
| 端子 | 1 Mic-in, 1 Line-out |
| イーサネット | |
| LAN 1 | Intel® I219LM GigE LAN supports iAMT |
| LAN 2 | Intel® I226IT 2.5GigE LAN supports TSN |
| PoE | |
| LAN 3 | Intel® I226IT 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ |
| LAN 4 | Intel® I226IT 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ |
| LAN 5 | Intel® I226IT 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ |
| LAN 6 | Intel® I226IT 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ |
| 2.5Gイーサネット(ECX-4025R/4025) | |
| LAN 7 | Intel® I225 2.5GigE LAN |
| LAN 8 | Intel® I225 2.5GigE LAN |
| LAN 9 | Intel® I225 2.5GigE LAN |
| 10G SFP+ (ECX-4071R/4071) | |
| LAN 7 | Intel® X710-BM2 supports IEEE 802.3 10GBASE-T |
| LAN 8 | Intel® X710-BM2 supports IEEE 802.3 10GBASE-T |
| 電源 | |
| 入力電圧1 | DC 9V to 50V, Redundant Power Input |
| 入力電圧2 | DC 9V to 50V, Redundant Power Input |
| インタフェース | 3-pin Terminal Block : V+, V-, Frame Ground |
|
イグニッション
コントロール
|
16-mode Software Ignition Control |
| リモートスイッチ | 3-pin Terminal Block |
| その他 | |
| TPM | Infineon SLB9672 supports TPM 2.0, SPI Interface |
|
ウォッチドッグ
タイマ (WDT)
|
Reset : 1 to 255 sec./min. per step |
|
スマート遠隔制御
|
Wake on LAN, PXE supported |
| HW Monitor | Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
| メカニカル設計 | |
| 外形寸法 | 260.0mm x 175.0mm x 79.0mm (10.24″ x 6.89″ x 3.11″) |
| 質量 | 3.8 kg (8.38 lb) |
| マウント |
– Wallmount by mounting bracket
– DIN Rail Mount (Optional)
– 2U Rackmount (Optional)
|
| 設置環境条件 | |
|
動作温度
(with airflow)
|
35W TDP CPU :
-40°C to 75°C (-40°F to 167°F), Fanless
65W TDP CPU :
-40°C to 55°C (-40°F to 131°F), Fanless
ECX-4025R/ECX-4025 :
-40°C to 70°C (-40°F to 158°F), Fanless
ECX-4071R/ECX-4071 :
-25°C to 55°C (-13°F to 131°F), Fanless
|
| 保存温度 | -40°C to 85°C (-40°F to 185°F) |
| 湿度 | 5% to 95% Humidity, non-condensing |
| 相対湿度 | 95% @75°C |
| 耐衝撃性 |
– IEC 60068-2-27
– SSD : 50G @wallmount, Half-sine, 11ms
|
| 耐振動性 |
– IEC 60068-2-64
– SSD : 5Grms, 5Hz to 500Hz, 3 Axis
|
| EMC指令 | CE, FCC, ICES, EN50155, EN50121-3-2 |
