EVS-3000
製品特長
PRODUCT FEATURE
・インテル® Core™ 200Sシリーズおよびインテル® Core™ プロセッサ(第14/13/12世代)（コードネーム : Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake‐S）搭載、インテルR680Eチップセット採用
・最大115WのNVIDIA® グラフィックカードでQuadro® /GeForce® MXM モジュール搭載対応、最大200Wの電源サポートが可能
・USB 3.2 Gen 2x2を装備することで最大20Gpsサポート
9～55VDC幅広い電源入力、ソフトウェアによるイグニッションコントロールサポート
・ファンレス仕様で5°C～65°C幅広い動作温度対応
・Allxonによるデバイスのリモート保護管理機能サポート（Out-of-Band Remote Management）
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Workstation-grade Platform
・Intel® Core™ 200S Series and 14/13/12th Gen Intel® Core™ Processor (codename: Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S) running with Intel R680E PCH, max 24-core 65W TDP 5.2GHz CPU supported.
・High-speed DDR5 5600MHz SO-DIMM, up to 96GB ECC/non-ECC Memory.
・Supports performance hybrid architecture and advanced AI capabilities for smarter and faster applications.
・Intel UHD Graphics 770 supports DirectX 12, OpenGL 4.5, OpenCL 3.0.
・Compact MXM Graphics card supports NVIDIA Ada Lovelace/Ampere/Turing architecture, empowers outstanding AI computing productivity with max 9728 CUDA Cores, 76 RT Cores, and 304 Tensor Cores, delivers 41.15 TFLOPS peak FP32 performance.
・High-speed data transfer : PCIe 4.0 (16GT/s), USB 3.2 Gen 2x2 Type-C (20G), USB 3.2 Gen 2 (10G), SATA III (6G), 2.5GigE LAN (2.5G) 
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Workstation-grade Platform
・Compact & fanless design.
・Intel Deep Learning Boost for accelerated AI performance.
・Intel Turbo Boost Technology 2.0 accelerates processor performance on peak loads.
・Optional supports low-profile discrete graphics card or AI accelerator, max 7680 CUDA cores, 240 Tensor cores, 60 RT cores.
・32 Isolated DIO : 16 DI, 16 DO.
・Supports Intel vPro, TPM 2.0, PXE, Wake on LAN for remote control.
・Supports TSN and Intel TCC for real-time control.
・OpenVINO toolkits support 500+ AI models optimized for AI Computing.
・Supports remote device Out-Of-Band management functions powered by Allxon. 
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Optimized System Reliability
・EN50155, EN50121-3-2, ICES, CE, FCC certified.
・New generation Liquid Cooling Solution supports Fanless 5°C to 65°C operation with 115W TDP MXM graphics.
Anti-shock & Anti-vibration : IEC 60068-2-27, ICE 60068-2-64, MIL-STD-810G.
・DC 9V to 55V wide range power input.
・Software Ignition Power Control for in-vehicle application.
・Supports 5G/WiFi/BT/4G/LTE/GPRS/UMTS wireless data transfer.
・Trusted Longevity supports.
・Max 200W power budget for discrete graphics card. 
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Diversity of Configurations
・Max 4 PCIe 4.0 expansions : 1 PCIe x8, 3 PCIe x4
・Lockable Storage : Front-access 2.5" SSD Tray, optional M.2 SSD Tray.
・Multiple compact M.2 connections for Storage and Expansion.
・Optional supports levels of Low-profile graphics card.
・Versatile product configuration for project requirements.
・PCIe expansions for multiple 10GigE M12 PoE+ LAN, 10GigE PoE+ LAN, 10GigE LAN, 10G SFP+, 2.5GigE PoE+ LAN, 2.5GigE LAN, M12 PoE+ LAN, PoE+ LAN, GigE LAN, LAN Switch, USB, or Discrete Graphics.
製品仕様
Product Specifications
| システム | |
| プロセッサ |
– 24-core Intel® Core™ 200S Series Processor (Bartlett Lake-S)
– 24-core Intel® Core™ i9/i7/i5/i3 Processor (14th gen, Raptor Lake-S Refresh)
– 24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
– 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
|
| チップセット | Intel® R680E |
| バイオス | AMI |
| SIO | IT8786E |
| メモリ | 2 DDR5 5600MHz SO-DIMM, up to 96GB (ECC/Non-ECC) |
| OS | Windows 11, Windows 10, Linux |
| I/Oインタフェース | |
| シリアル | 2 COM RS-232/422/485 (ESD 8kV) |
| USB |
– 4 USB 3.2 Gen 2 Type A
– 1 USB 3.2 Gen 2×2, USB Type-C supports max 20Gbps data transfer (15W, 5V/3A)
|
| Isolated DIO | 32 Isolated DIO (16 DI, 16 DO) |
| LEDランプ | Power, HDD, OOB |
| SIMカード | 1 External SIM Card Socket for 5G/4G/LTE/GPRS/UMTS wireless network |
| 拡張スロット | |
| PCIe | 1 PCIe x16 Slot with x8 Signal |
| M.2 |
– 1 M.2 Key B Socket (2280/3042/3052, PCIe/USB 3, default/SATA)
– 1 M.2 Key E Socket (2230, PCIe/USB)
|
| グラフィックス | |
| プロセッサ | Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture |
| インタフェース |
Up to 7 independent displays:
– 2 HDMI 2.1: Up to 4096 x 2304 @60Hz
– 1 DP: Up to 3840 x 2160 @60Hz
– 4 DP: Up to 7680 x 4320 @60Hz (By requested MXM)
|
| ストレージ | |
| SATA | 2 SATA III (6Gbps) support S/W RAID 0, 1, with 2 Front-access 2.5″ SSD/HDD Tray |
| M.2 | 1 M.2 Key M Socket (2280, PCIe x4) |
| オーディオ | |
| コーデック | Realtek ALC888S-VD, 7.1 Channel HD Audio |
| 端子 | 1 Mic-in, 1 Line-out |
| イーサネット | |
| LAN 1 | Intel® I226 2.5GigE LAN supports TSN |
| LAN 2 | Intel® I226 2.5GigE LAN supports TSN |
| 電源 | |
| 入力電圧 | DC 9V to 55V |
| インタフェース | 3-pin Terminal Block : V+, V-, Frame Ground |
| イグニッション コントロール |
16-mode Software Ignition Control |
| リモートスイッチ | 3-pin Terminal Block |
| OOB管理 | |
| MCU | Nuvoton NUC980 |
| インタフェース | OOB LAN, 10/100Mb Ethernet LAN, RJ45 Connector |
| リモートスイッチ | Support Remote Power ON/OFF, Reset and Power Cycling |
| その他 | |
| TPM | Infineon SLB9670 supports TPM 2.0, SPI Interface |
|
ウォッチドッグ
タイマ (WDT)
|
Reset : 1 to 255 sec./min. per step |
| スマート遠隔制御 | Wake on LAN, PXE supported |
| HW Monitor | Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
| メカニカル設計 | |
| 外形寸法 | 280mm x 93.4mm x 215mm (11.02″x 3.68″x 8.46″) |
| 質量 | 5.7 kg (12.56 lb) |
| マウント |
– Wallmount by mounting bracket
– VESA Mount (Optional)
– DIN Rail Mount (Optional)
– Rackmount (Optional)
|
| 設置環境条件 | |
| 動作温度 | 5°C to 65°C (41°F to 149°F) |
| 保存温度 | -40°C to 85°C (-40°F to 185°F) |
| 湿度 | 5% to 95% Humidity, non-condensing |
| 相対湿度 | 95% at 65°C |
|
耐衝撃性
|
– IEC 60068-2-27
– SSD: 50G @wallmount, Half-sine, 11ms
|
|
耐振動性
|
– IEC 60068-2-64
– SSD: 5Grms, 5Hz to 500Hz, 3 Axis
|
| EMC指令 | CE, FCC, ICES, EN50155, EN50121-3-2 |
