IVX-1000 (M12)
製品特長
PRODUCT FEATURE
・インテル® Core™ 200Sシリーズおよびインテル® Core™ プロセッサ(第14/13/12世代)（コードネーム : Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake‐S）搭載
・オプションでコンパクトなNVIDIA® グラフィックカードでQuadro® /GeForce® MXM モジュール搭載対応
・DC電源で最大16V-160V入力可能、500Vサージ保護機能装備、ソフトウェアによるイグニッション制御、オプションでUPSサポート
・EN50155: 2017規格に準拠、鉄道車両の搭載に最適なファンレス仕様
・独立で動作する2.5G LANポート8基装備、うち4基M12 Xコードコネクタ仕様でIEEE 802.3at PoE+対応、2.5GigEとGigE LAN各1口装備、4基絶縁型COMポート装備
・2枚7mmのSSD/HDDトレイ対応、5G/WiFi/4G/3G/LTE/GPRS/UMTS多彩な通信方式サポート
・Intel® vPro、TCC、Time-Sensitive Networking（TSN）とTPM 2.0規格サポート
・お客様のニーズによるOpenVINO x VHub AIで ワンストップAIoTソリューションとエッジAI提案
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Advanced Digital Rail Platform
・Workstation-grade Platform : Intel® Core™ 200S Series and 14/13/12th Gen Intel® Core™ Processor (codename: Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S), up to 65W TDP CPU supported
・Dual DDR5 5200MHz SO-DIMM, up to 96GB ECC/non-ECC Memory
・Supports performance hybrid architecture and advanced AI capabilities for smarter and faster applications
・Optional delivers outstanding AI computing productivity supporting max 5888 CUDA Cores, 46RT Cores, 184 Tensor Cores, and 17.66 TFLOPS peak FP32 Performance
・High-speed data transfer : PCIe 4.0 (16GT/s), USB 3.2 Gen 2 (10G), SATA III (6G), 2.5GigE LAN (2.5G), GigE LAN (1G)
・Optional VHub One-Stop AIoT Solution Service supports OpenVINO based AI accelerator and advanced Edge AI applications 
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Rugged Reliability
・9 independent 2.5GigE LAN : 1 2.5G LAN supports TSN, 4 2.5G LAN with X-coded M12 Connector, 4 IEEE 802.3at 2.5G PoE+ (25.5W/48V) with X-coded M12
・5 USB : 4 10G USB 3.2 Gen 2, 1 A-coded M12 USB 2.0 with 2-port signal
・4 COM RS-232/422/485, 2 SIM Socket, 16 Isolated DIO, optional SUMIT A, B
・Max 6 external 2.5” SSD/HDD trays, 15mm in height, RAID 0, 1, 5, 10 Data Protection
・Compact M.2 Configurations : M.2 Key B, M.2 Key E, M.2 Key M
・Wireless Connections : 5G/WiFi/4G/BT/3G/LTE/GPRS/UMTS
・Intel Deep Learning Boost (Intel DL Boost) and Intel Distribution of OpenVINO toolkit for AI Computing
・Optional supports advanced NVIDIA Ampere Architecture and NVIDIA Turing Architecture by compact & fanless MXM Graphics 
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Railway-oriented Consideration
・Fully EN50155 : 2017 compliant
・EN45545-2 Fire Protection compliant
・Rugged Connections : X-coded M12 PoE+ LAN, X-coded M12 GigE LAN, A-coded M12 USB
・Multiple SIM sockets for always-on wireless communication supporting seamless data delivery
・Rugged & lockable SSD/HDD Tray, Isolated COM, Isolated DIO
・DC 16V to 160V Wide Range Power Input with 4kV Isolation, 500V Surge Protection
・Ignition Power Control for in-vehicle applications
・Anti-shock, Anti-vibration 
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Optimized Manageability
・DC 16V to 160V ultra wide range power input flexible serves variety of in-vehicle computing tasks
・Optional UPS secures system operation
・Rackmount and single-side control interface design makes user-friendly system maintenance possible
・Data Protection : Front-access & lockable SSD/HDD trays, max 24TB capacity, RAID 0, 1, 5, 10 supported
・Real-time capable with Intel Time Coordinated Computing (Intel TCC) and support for Time-Sensitive Networking (TSN)
・Smart System Management : vPro, TPM 2.0, PXE, Wake on LAN, Watchdog Timer
製品仕様
Product Specifications
| システム | |
| プロセッサ |
– 24-core Intel® Core™ 200S Series Processor (Bartlett Lake-S)
– 24-core Intel® Core™ i9/i7/i5/i3 Processor (14th gen, Raptor Lake-S Refresh)
– 24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
– 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
|
| チップセット | Intel® R680E |
| BIOS | AMI |
| SIO | IT8786E |
| メモリ | 2 DDR5 5200MHz SO-DIMM, up to 96GB |
| OS | Windows 11, Windows 10, Linux |
| I/Oインタフェース | |
| シリアル | 4 Isolated COM RS-232/422/485 |
| USBポート |
– 4 USB 3.2 Gen2
– 1 A-coded M12 USB 2.0 with 2-port signal
|
| Isolated DIO | 16 Isolated DIO : 8 DI, 8 DO |
| LEDランプ | Power, HDD, PoE, Wireless |
| SIMカード | 2 External SIM Card Sockets |
| RTCバッテリー | Front-access RTC Battery |
| 拡張スロット | |
| Mini PCIe | 1 Mini PCIe sockets for PCIe/USB/SIM Card/Optional mSATA |
| M.2 |
– 1 M.2 Key B Socket (3052/2280, PCIe/USB 3, default/USB 2)
– 1 M.2 Key E Socket (2230, PCIe/USB)
|
| SUMIT | 2 SUMIT Slot (Optional) |
| グラフィックス | |
| グラフィックス プロセッサ |
– Intel® UHD Graphics 770/730 driven by Intel® Xe Architecture
– Independent MXM Graphics : By request |
| インタフェース |
– 1 VGA : Up to 1920 x 1200 @60Hz
– 2 HDMI : Up to 1920 x 1080 @60Hz
– 2 DisplayPort : Up to 4096 x 2304 @60Hz (By requested MXM)
|
| ストレージ | |
| SATA | 2 SATA III (6Gbps) support software RAID 0, 1 |
| mSATA | 1 SATA III (Mini PCIe Type, 6Gbps) |
| M.2 | 1 M.2 Key M Socket (2280, PCIe x4) |
| その他 | 2 Front-access 2.5″SSD/HDD Tray |
| オーディオ | |
| コーデック | Realtek® ALC888S-VD, 7.1 Channel HD Audio |
| 端子 | 1 Mic-in, 1 Line-out |
| イーサネット | |
| LAN 1 | Intel® I219LM GigE LAN |
| LAN 2 | Intel® I226 2.5GigE LAN supports TSN |
| LAN 3 | Intel® I226 2.5GigE LAN, X-Coded M12 Connector |
| LAN 4 | Intel® I226 2.5GigE LAN, X-Coded M12 Connector |
| LAN 5 | Intel® I226 2.5GigE LAN, X-Coded M12 Connector |
| LAN 6 | Intel® I226 2.5GigE LAN, X-Coded M12 Connector |
| LAN 7 | 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, X-Coded M12 Connector |
| LAN 8 | 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, X-Coded M12 Connector |
| LAN 9 | 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, X-Coded M12 Connector |
| LAN 10 | 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I226, X-Coded M12 Connector |
| 電源 | |
| 入力電圧 | DC 16V to 160V, max. support 200W |
| インタフェース | 3-pin Terminal Block : V+, V-, Frame Ground |
| イグニッション コントロール |
16-mode Software Ignition Control |
| リモートスイッチ | 3-pin Terminal Block |
| Isolation | 4kV DC |
| サージ保護 | 0.5kV DC 8/20us Surge |
| その他 | |
| TPM | Infineon SLB9670 supports TPM 2.0, SPI Interface |
| ウォッチドッグ タイマ(WDT) |
Reset : 1 to 255 sec./min. per step |
| 遠隔制御 | Wake on LAN, PXE supported |
| HW Monitor | Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
| メカニカル設計 | |
| 外型寸法 | 360mm x 228mm x 88mm (14.2″ x 8.9″ x 3.5″) |
| 質量 | 7.1 kg (15.65 lb) |
| マウント |
– Wallmount by mounting bracket
– Rackmount (Optional)
|
| 設置環境条件 | |
| 動作温度 |
35W TDP CPU without GPU : -25°C to 75°C (-13°F to 167°F), with air flow
35W TDP CPU with <50W GPU : –25°C to 55°C (-13°F to 131°F), with air flow
65W TDP CPU without GPU : -25°C to 65°C (-13°F to 149°F), with air flow
65W TDP CPU with <50W GPU : -25°C to 45°C (-13°F to 113°F), with air flow
|
| 保存温度 | -40°C to 85°C (-40°F to 185°F) |
| 湿度 | 5% to 95% Humidity, non-condensing |
| 相対湿度 | 95% at 55°C |
| 耐衝撃性 耐振動性 |
– IEC 61373 : 2010
– Railway Applications : Rolling Stock Equipment, Shock and Vibration Test
|
| EMC指令 | CE, FCC, EN50155, EN50121-3-2 |
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