HEC-1000
製品特長
PRODUCT FEATURE
・インテル® Core™ 200Sシリーズおよびインテル® Core™ プロセッサ(第14/13/12世代)（コードネーム : Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake‐S）搭載、インテルR680Eチップセット採用、最大TDP 65Wプロセッササポート
・IP66規格を備えたMIL-DLT-38999コネクタ採用、6基USB、3口2.5G LAN、4基COM RS-232/422/485、GigE LANとDVI-Iは各1基ポート装備
・外部より便利な2基2.5" SSD/HDDトレイ付き
・アメリカ国防総省制定MIL規格準拠 (MIL-STD-810G、MIL-STD-461G)
・DC電源で最大9V-50V入力サポート
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High-reliability Optimization
・MIL-DTL-38999 Series III Connectors with IP66 Protection
・Dual Front-access Lockable Waterproof SSD/HDD Tray
・EMC : MIL-STD-461G, EN50155, FCC, CE
・Anit-shock : MIL-STD-810G
・Anti-vibration : MIL-STD-810G
・High & Low Operating Temperature : MIL-STD-810G
・Waterproof Breathable Valve secures system operation 
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High-performance Computing Platform
・Intel® Core™ 200S Series and 14/13/12th Gen Intel® Core™ Processor (codename: Bartlett Lake-S/Raptor Lake-S Refresh/Raptor Lake-S/Alder Lake-S), running with Intel R680E PCH, max 24-core 35W TDP 5.0GHz CPU supported
・2 DDR4 3200MHz Memory, up to 64GB, optional supports ECC
・Supports performance hybrid architecture and advanced AI capabilities for smarter and faster applications
・Intel UHD Graphics 770 supports DirectX 12, OpenGL 4.5, OpenCL 3.0
・High-speed data transfer : PCIe 4.0 (16GT/s), SATA III (6G), 2.5GigE LAN (2.5G), GigE LAN (1G)
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Advanced Integration
・Intel Deep Learning Boost for accelerated AI performance
・Intel Turbo Boost Technology 2.0 accelerates processor performance on peak loads
・Supports Intel vPro Enterprise, TCC, TSN, and TPM 2.0
・Fully supports Intel OpenVINO toolkit for AI Computing 
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Rugged Operation
・3 Intel 2.5GigE LAN and 1 Intel GigE LAN, Trusted Longevity supports
・4 COM RS-232/422/485, 6 USB
・Multiple compact M.2 Key B, M.2 Key E, M.2 Key M connections for Storage and Expansion
・DC 9V to 50V Wide range power input facilitates various operating environments
製品仕様
Product Specifications
| システム | |
| プロセッサ |
– 24-core Intel® Core™ 200S Series Processor (Bartlett Lake-S)
– 24-core Intel® Core™ i9/i7/i5/i3 Processor (14th gen, Raptor Lake-S Refresh)
– 24-core 13th Gen Intel® Core™ i9/i7/i5/i3 Processor (Raptor Lake-S)
– 16-core 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
|
| チップセット | Intel® R680E |
| GPU | Intel® UHD Graphics 770/730 |
| BIOS | AMI |
| SIO | IT8786E |
| メモリ | 2 DDR4 3200MHz SO-DIMM, up to 64GB (ECC/Non-ECC) |
| OS | Windows 11, Windows 10, Linux |
| I/Oインタフェース (D38999コネクタ採用) | |
| シリアル | 4 COM RS-232/422/485 |
| USB | 6 USB 2.0 |
| ディスプレイ | DVI-I : Up to 1920 x 1080 @60Hz |
| 拡張スロット | |
| Mini PCIe |
1 Mini PCIe Socket for PCIe/USB/SIM Card/Optional mSATA
**Optional customization by request
5G Module, 4G Module, WiFi & Bluetooth
|
| M.2 |
– 1 M.2 Key B Socket (3042/3052, SATA/USB 3, default/USB 2)
– 1 M.2 Key E Socket (2230, PCIe x2/USB)
**Optional customization by request
5G Module, 4G Module, WiFi & Bluetooth
|
| ストレージ | |
| SATA | 2 SATA III (6Gbps) support software RAID 0, 1 |
| mSATA | 1 SATA III (Mini PCIe Type, 6Gbps) |
| M.2 | 1 M.2 Key M Socket (2280, PCIe x4) |
| その他 | 2 Front-access 2.5″ SSD/HDD Tray |
| オーディオ | |
| コーデック | Realtek® ALC888S-VD, 7.1 Channel HD Audio |
| 端子 | 1 Mic-in, 1 Line-out |
| イーサーネット | |
| LAN 1 | Intel® I219LM GigE LAN supports iAMT |
| LAN 2 | Intel® I226 2.5GigE LAN supports TSN |
| LAN 3 | Intel® I226 2.5GigE LAN supports TSN |
| LAN 4 | Intel® I226 2.5GigE LAN supports TSN |
| 電源 | |
| 入力電圧 | DC 9V to 50V, AT mode |
| インタフェース | 4-pin MIL-DTL-38999 Connector |
| その他 | |
| TPM | Infineon SLB9670 supports TPM 2.0, SPI Interface |
| ウォッチドッグ タイマ (WDT) |
Reset : 1 to 255 sec./min. per step |
| HW Monitor | Monitoring temperature, voltages. Auto throttling control when CPU overheats. |
| メカニカル設計 | |
| 外形寸法 | 275.0mm x 376.0mm x 130.0mm (10.82″ x 14.8″ x 5.11″) |
| 質量 | 15.2 kg (33.5 lb) |
| マウント | Wallmount by mounting bracket |
| 設置環境条件 | |
| 動作温度 | -40°C to 65°C (-40°F to 149°F) with air flow |
| 保存温度 | -55°C to 85°C (-67°F to 185°F) |
| 湿度 | 5% to 95% Humidity, non-condensing |
| 相対湿度 | 95% @65°C |
| 低気圧（高度） | MIL-STD-810G method 500.5, Procedure II |
| 高温 | MIL-STD-810G method 501.5, Procedure II |
| 低温 | MIL-STD-810G method 502.5, Procedure II |
| 耐衝撃性 | MIL-STD-810G method 514.6, Category 24 |
| 耐振動性 | MIL-STD-810G method 516.6, Procedure I |
| EMC指令 | CE, FCC, MIL-STD-461G |
